I-PEX offers a wide lineup of connectors with different mating heights to meet various designs and use cases. Our newest board-to-board connectors combine compact size and functionality with a mating height of just 1.5 mm – ideal for space constrained applications.

The market size of AR/VR/MR is expected to continue to grow significantly in the future, with the strength of improving the sense of immersion in virtual reality. As the pursuit of higher image quality, smaller size, and lighter weight AR/VR/MR devices accelerates, I-PEX contributes to the design of devices with connectors that are both smaller and transmit data faster.

I-PEX offers CABLINE^®-CA IIP PLUS low-profile connecter with jumper cables employing our paddle card technology for card-to-card and card-to-board connection of DPU supporting PCIe Gen5.0.

PCL reported verification results of 100 Gbps transmission using an FPGA platform at the China Semiconductor Technology International Conference. I-PEX’s LIGHTPASS^®-EOB 100G optical module is one of the components on the FPGA-based verification platform by PCL. The results of PCL’s research have demonstrated the suitability of the newly created FPGA-based verification platform for characterizing high-speed data rates of 100 Gbps with 4×25G SerDes TX/RX.

By selecting I-PEX's locking micro RF connector with a wireless module that allows for installation space, the mechanical retention and stability of the wireless module and antenna connection are significantly enhanced. This solution is ideal for devices operating in environments with vibration and impact, ensuring stability and reliability in network communication.