Ideal for 5G mmWave antenna module and devices, fully-shielded and narrow design, Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7 mm height
Featuring mechanical and signal transmission benefits and advantages of Micro-Coaxial Cable Assemblies. These assemblies are capable of handling high data rates, while providing high degree of flexibility and high shielding performance.
The I-PEX connector product lineup includes a series of connectors that employ a common design concept with multiple connection options.
For PCB module products that are versatile for a variety of electronic devices, adopting a connector with a common design concept allows for the selection of multiple connection methods. As the number of PCB module connection method options increases, the markets for devices that can be targeted will also expand. I-PEX proposes to use the common design connectors with wide range of connection method options, especially when developing highly versatile modules.
Notebook PCs and tablets, which are densely populated with various electronic components, antennas are often mounted nearby, and MIPI signals may adversely affect the antennas. Therefore, EMC measures are very effective to prevent signal interference between them. The I-PEX ZenShield® connector series can provide excellent EMC countermeasures.
In recent years, device makers are paying much more attention to slimmer designs, which requires more innovative ideas to fit components in these much smaller spaces.
The CABLINE® series harness assemblies are not only capable of transmitting high-speed signals, but they can also be threaded through hinge components in a limited space.
The deployment of 5G networks, along with their connected devices, will demand more from current connector structures. This investment in connector technology, for high-volume manufacturing, will have to be balanced between performance, size, and cost to thrive in the market.
ZenShield® is the brand name for the I-PEX small connector series having high-performance EMC shielding design.
ZenShield® gives board designers more flexibility for designing the board by allowing the connectors to be placed in close proximity to sensitive subsystems, such as transmit/receive antennas, that are commonly found in high-performance wireless communication systems.
The market size of AR/VR/MR is expected to continue to grow significantly in the future, with the strength of improving the sense of immersion in virtual reality. As the pursuit of higher image quality, smaller size, and lighter weight AR/VR/MR devices accelerates, I-PEX contributes to the design of devices with connectors that are both smaller and transmit data faster.