I-PEX has developed the LIGHTPASS^®-EOB 100G on-board optical module. This article describes the detailed contents of that optical module. The following are its typical features.

• The on-board ultra-thin optical transceiver is designed for near-packaged optics (NPO) and enables 100 Gbps transmission.
• The light source is mounted on an optical transceiver engine, and no external light source is required.
• The laser is a quantum dot laser, ensuring sufficient lifetime and reliability even in high temperature operation.
• To create a low-profile module, a diagonal-cut fiber array is used, which results in a module height of 2.3 mm.
• It has a high heat dissipation structure, and maintains error-free (BER < 1E-12) performance, even at a case temperature (Tc) of 105°C. 
• It can be used in a wide range of applications(e.g., test equipment, sensors, cameras, robots, medical, aerospace, and vehicles.

The key features of the LIGHTPASS product family are:

1: Ultra-thin optical module
2: Ultra-small optical transceiver engine
3: High-speed, low-profile, electrical connector
4: Ultra-low-profile fiber array
5: High heat dissipation module structure
6: Ultra-thin optical transceiver module evaluation results
Conclusion

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1: Ultra-thin optical module

LIGHTPASS^®-EOB 100G

The ultra-thin optical module EOB (Embedded Optical Blade) takes its name from the general term EOM (Embedded/Electro Optical Module), which describes an optical-electrical conversion module. 

1) Product Specifications

• Transmission rate: 100 Gbps (NRZ, 25 Gbps x 4 channels) bidirectional
• Size: (W) 29.8 mm x (D) 29.0 mm x (H) 2.3 mm
• Optical fiber: Φ50/125 MMF
• Wavelength: 1310 nm
• Electronics Interface: CABLINE^®-CA 0.4 mm pitch, 60 pin, Horizontal mating connector with mechanical lock
• Optical interface: 12-core MT connector, 250 μm pitch
• Operability: Built-in MCU, no user control required
• Operating temperature range: -40°C ~ +85°C (+105°C) case temperature
• Safety: Class 1

 

2) Components

 

3) Features

  1. Ultra-thin construction

Low component height allows mounting under heat sinks and fans or placement near the ASIC, minimizing board transmission loss.

 

  2. High heat release mechanism

Heat is diffused by thin, metal shell and flat structure.

 

  3. Mechanical locking structure

Locking bars on connectors prevent half-mating and un-mating, and anchors prevent optical modules from floating due to vibration.

 

 

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next chapter: 2: Ultra-small optical transceiver engine