News & Updates

I-PEX has released CABLINE®-CA IIP PLUS, which is compatible with both twinax and micro-coaxial cables, adding to its existing CABLINE® series of connectors. CABLINE®-CA IIP PLUS is optimized for high-speed 64 Gbps/lane PAM4 internal connections, featuring full 360° EMC shielding for noise immunity.
How to mate and unmate the CABLINE®-CA IIP PLUS Micro-Coaxial Cable Connectors.
I-PEX has released CABLINE®-CA IIF PLUS. CABLINE®-CA IIF PLUS is a shielded FPC connector with ZenShield®, which is ideal for high-speed transmission internal connections at 32 Gbps/lane and provides noise suppression with 360° EMC shielding.
How to mate and unmate the CABLINE®-CA IIF PLUS Micro-Coaxial Cable Connectors.
I-PEX Inc., a leading high-speed connector and cable assembly supplier, announced that Spectra7 Microsystems Inc., a leading provider of high-performance analog semiconductor products for broadband connectivity markets, will provide GC1122 GaugeChanger™ chips for the CABLINE®-CA IIEQ PLUS 112G active copper cable (ACC) that will be offered to hyperscalers and OEM/ODMs for 112G PAM4 applications.
In recent years, high-speed transmission in servers, switches, and other enterprise telecommunications equipment has been advancing at a rapid pace, and this has  increased the need to improve the signal integrity (SI) performance of components used in each system. To meet this demand, I-PEX is developing an active copper cable (ACC) solution called CABLINE®-CA IIEQ PLUS 112G that supports 4 lanes of 112 Gbps PAM4 high-speed transmission. This product will be exhibited at OCP 2024 to be held in San Jose, California, USA from October 15 to 17, 2024.
How to mate and unmate the CABLINE®-CA Micro-Coaxial Cable Connectors.
I-PEX is developing the "LIGHTPASS®-SP Q28", a multi-mode QSFP28 specification Active Optical Cable (AOC) that uses silicon photonics ICs for outdoor communication equipment requiring reliability in long-term use under high-temperature environments. This product will be exhibited as a reference at ECOC, held in Frankfurt, Germany, from September 23 to September 25, 2024.
A vertical type board-in connector is being added to the I-PEX IARPB® connector series, which has been well received in the automotive market due to its light weight and compact design.
A vertical type board-in connector is being added to the I-PEX IARPB® connector series, which has been well received in the automotive market due to its light weight and compact design. Recently, functions such as adaptive driving beam (ADB) have been added to headlamps, and there is a continuing demand for space saving components. To address this demand, we have developed the vertical type board-in connector. This product improves space efficiency by routing the wire harness vertically to the board, which may increase the degree of freedom in circuit board design and helps customers further reduce the weight and size of their designs.