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Smartphone

    SMARTPHONE
  • Display
  • Front Camera
  • Rear Camera
  • Button Controls
  • Battery
  • Antenna
  • Grounding
SMARTPHONE
    FOLDABLE PHONE
  • Dual Display
FOLDABLE PHONE
Display
NOVASTACK® 35-P
Robust connector with hold-down feature and Corson Alloy main contacts to transmit power, 0.35 mm pitch, 0.7 mm height, 2.3 mm depth
  • BOARD TO BOARD
  • POWER PIN
MINIFLEX® 175-ST
Super low profile (height = 0.52 mm), 0.175 mm pitch, horizontal mate, backflip
  • FPC
MINIFLEX® 3-BFN
Low profile (Height = 0.9 mm), 0.3 mm pitch, horizontal mating, backflip
  • FPC
Front Camera
NOVASTACK® 35-P
Robust connector with hold-down feature and Corson Alloy main contacts to transmit power, 0.35 mm pitch, 0.7 mm height, 2.3 mm depth
  • BOARD TO BOARD
  • POWER PIN
NOVASTACK® 35-HDN
Fully-shielded and narrow design, Good performance at high frequency and high speed signals. Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7mm height
  • BOARD TO BOARD
  • EMI SHIELD
Rear Camera
CABLINE®-CX II Without Cover
Narrow pitch (0.25 mm pitch), Low mating height (Height = 0.78 mm max), Mechanical lock with shielding and multi-point ground, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-UX II
Slim design suitable for through-hole solution,　narrow pitch (0.25 mm), Right angle vertical mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
NOVASTACK® 35-P
Robust connector with hold-down feature and Corson Alloy main contacts to transmit power, 0.35 mm pitch, 0.7 mm height, 2.3 mm depth
  • BOARD TO BOARD
  • POWER PIN
NOVASTACK® 35-HDN
Fully-shielded and narrow design, Good performance at high frequency and high speed signals. Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7mm height
  • BOARD TO BOARD
  • EMI SHIELD
Button Controls
MINIFLEX® 175-ST
Super low profile (height = 0.52 mm), 0.175 mm pitch, horizontal mate, backflip
  • FPC
MINIFLEX® 3-BFN
Low profile (Height = 0.9 mm), 0.3 mm pitch, horizontal mating, backflip
  • FPC
NOVASTACK® 35-P
Robust connector with hold-down feature and Corson Alloy main contacts to transmit power, 0.35 mm pitch, 0.7 mm height, 2.3 mm depth
  • BOARD TO BOARD
  • POWER PIN
Battery
NOVASTACK®-B
Supports high power delivery, robust design, 0.4 mm pitch, 0.6 mm height, 2.6 mm depth
  • BOARD TO BOARD
  • POWER PIN
Antenna
NOVASTACK® 35-HDN
Fully-shielded and narrow design, Good performance at high frequency and high speed signals. Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7mm height
  • BOARD TO BOARD
  • EMI SHIELD
MHF® 4L
The M.2 industry standard, mated height of 1.2 mm, 1.4 mm, and 1.7 mm max.,excellent electrical performance up to 12 GHz
  • MICRO-COAXIAL
MHF® 4L (1.4 mm height)
The M.2 industry standard, mated height of 1.4 mm max., excellent electrical performance up to 12 GHz
  • MICRO-COAXIAL
MHF® 4L (1.7 mm height)
The M.2 industry standard, mated height of 1.7 mm max., excellent electrical performance up to 12 GHz
  • MICRO-COAXIAL
MHF® 5
Low-profile (mated height = 1.0 mm max.), supports to 12 GHz
  • MICRO-COAXIAL
MP-A
Surface mount cable clip and clamp for RF assembly grounding and cable routing
  • SMT CLIP
Grounding
MP-A
Surface mount cable clip and clamp for RF assembly grounding and cable routing
  • SMT CLIP
Dual Display
CABLINE®-UX II
Slim design suitable for through-hole solution,　narrow pitch (0.25 mm), Right angle vertical mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CX II With Cover
Narrow pitch (0.25 mm pitch), Low mating height (Height = 1.00 mm max.), EMI shielding cover and multi-point ground with mechanical lock, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CX II Without Cover
Narrow pitch (0.25 mm pitch), Low mating height (Height = 0.78 mm max), Mechanical lock with shielding and multi-point ground, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CA
High-data-rate transfer (32 Gbps/Lane), mechanical lock with shielding and multi-point ground, 0.4 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CA II
Fully-shielded with mechanical lock, suitable for high-data-rate transfer (32 Gbps/lane), 0.4 mm pitch, horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE
CABLINE®-CAL
Low mating height (Height = 0.8 mm max.), High-data-rate transfer (40 Gbps/lane PAM3), Mechanical lock, 0.4 mm pitch, Horizontal mating type micro-coaxial connector
  • MICRO-COAXIAL
  • DISCRETE WIRE

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Excellent EMC performance with fully-shielded design, ideal for 5G mmWave applications, VSWR 1.5 max at 15 GHz in small 2.0 x 2.0 mm footprint
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NOVASTACK® 35-HDN / 5G Connector : Shielded Board to Board Connector

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Micro-Coaxial Cable Assembly Capabilities

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I-PEX ZenShield® connectors are recommended for signal transmission from camera module using MIPI

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Design Consideration, Tips & Techniques for 5G Connector Solutions

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ZenShield®: High-Performance EMC Shielding Connectors

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What is 5G?

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RF Connectors

I-PEX offers RF Connectors, Cable Assemblies and Switches that are ideal for 5G mmWave and Sub-6, 4G LTE, Wi-Fi® ,Bluetooth®, GPS, WiGig™, M2M, IoT, SigFox, WiSUN, NB-IoT and LoRa® applications. I-PEX® MHF® Micro RF Coaxial Connectors are used to connect antennas to radios while maximizing performance within minimal space. The patented i-Fit® process equals reliability at scale and consistent VSWR performance up to 15 GHz. With cable options ranging from 0.48 mm to 2.0 mm OD and mated board heights between 0.8 mm and 3 mm, I-PEX Connectors offers solutions to fit your space. Whether in production or while performing testing, I-PEX Connectors has an RF solution for a wide array of applications.

Board-to-Board (FPC) Connectors

I-PEX® NOVASTACK® Board-to-Board FPC Connectors are available in a 0.4 mm and 0.35 mm pitch with options for power pins and high visibility mating. These connectors have high data rate / high frequency options with 360 degree EMI shielding, making them ideal for 5G mmWave / Sub-6, USB®4, ThunderboltTM4 and eDP HBR3 applications.