BOARD TO BOARD

NOVASTACK^® 35-HDH

1.5 mm height, 0.35 mm pitch , Fully-shielded and high-profile design, High-speed 20 GHz (≒40 Gbps)/lane transmission

AP-10

High-power supply terminal, high heat resistance board-to-board connection. Contribute to miniaturization of power electronics devices, height differences can be customized.

ISFIT^® (Press-Fit Terminal)

Wire-to-board/board-to-board, 4-points spring contact press-fit terminal

NOVASTACK^® 35-HDN

Ideal for 5G mmWave antenna module and devices, fully-shielded and narrow design, Power supply is available with Corson Alloy contact, 0.35 mm pitch, 0.7 mm height

NOVASTACK^® 35-PH

1.5 mm height connector with long effective contact wipe length, power contacts, 0.35 mm pitch, vertical mating

NOVASTACK^®-B

Supports high power delivery, robust design, 0.4 mm pitch, 0.6 mm height, 2.6 mm depth

NOVASTACK^® 4

Narrow and low profile, 0.4 mm pitch, 0.6 mm height, 1.88 mm depth

NOVASTACK^® 35-HDP

High-speed (20+ Gbps/lane) fully-shielded with power contacts, 0.35 mm pitch, 0.7 mm height

NOVASTACK^® 35-P

Robust connector with hold-down feature and Corson Alloy main contacts to transmit power lines, 0.35 mm pitch, 0.7 mm height, 2.3 mm depth